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88 PCB007 MAGAZINE I DECEMBER 2019 than 0.05 µm thick. For example, mapping mode makes it easy to scan surfaces, and dur- ing production or incoming goods inspection, the testing of different components in large quantities. X-RAY XDAL SDD Features • Universal instrument for automated measurements of thin and very thin films (<0.05 µm) and for material analysis in the ppm range • Microfocus tube with tungsten anode • Three-fold exchangeable primary filter • Four-fold exchangeable apertures • Options for different semiconductor detectors (silicon PIN detector, SDD 20 mm 2 , SDD 50 mm 2 ) Ram Optical Sprint MVP 600 Coordinate measurement machines (CMMs) are becoming a more integral component of PCB shops' inspection and verification capabil- ity given the increasing complexity of today's designs. Add in the 3D measurement require- ments common with high-tech products, like rigid-flex and external heat sinks with complex milling and cavities, and advanced measure- ment equipment is a must-have. The 600 in