SMT007 Magazine

SMT007-Jan2020

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92 SMT007 MAGAZINE I JANUARY 2020 perature of the underfill means that there will be a slight deviation for this rework profile. Summary By concentrating on these five factors, a more repeatable rework process for underfilled PCBs can be developed. SMT007 References 1. J. Burke and A.D. Chunsheng, "Laser Rework Process for BGA: A New Method for PCBA Rework Instead of Hot Air/ Infrared Heating," October 2018, SMTAI. 2. A. Gaynor and B. Wettermann, "Shielding Effective- ness of Polyimide Tape During Rework," October 2014, Circuits Assembly. Bob Wettermann is the principal of BEST Inc., a contract rework and repair facility in Chicago. For more information, contact info@solder.net. To read past columns or contact Wettermann, click here. Brook Sandy-Smith, IPC's technical conference program manager, highlights how attendees can learn about and test drive new equipment, materials, and solutions by visiting the nearly 500 exhibiting companies and enjoy the welcome reception and ice cream social on the show floor. Click image below to watch video. (Source: IPC) IPC APEX EXPO Show Floor

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