Issue link: https://iconnect007.uberflip.com/i/1202019
44 PCB007 MAGAZINE I JANUARY 2020 Semi-additive PCB processes help to enable very fine features, with trace and space down to 25 microns and below, significantly reduc- ing space and weight for next-generation elec- tronics. Tara Dunn speaks with Todd Brassard and Meredith LaBeau from Calumet Electron- ics about how the company is the first domes- tic PCB manufacturer to license Averatek's A-SAP™ process and will be presenting infor- mation on the industrialization of this process at this year's IPC APEX EXPO. Tara Dunn: Thank you for taking the time to talk with me about Calumet Electronics and some of the exciting things you have going on at IPC APEX EXPO this year. Can you provide a little bit of background about Calumet Electronics and your roles there? Todd Brassard: Thanks, Tara. I serve as the VP and COO at Calumet Electronics. Meredith LaBeau: And I am the director of pro- cess engineering and one of the chief strategic planners. Brassard: Calumet Electronics has a great story dating back to 1968, preceded by 100 years of copper mining. Our company's founding mis- sion was to provide jobs to the region as the copper mines closed. This remains a strong component of our mission still, which is to provide careers for good people. Today, Calu- met Electronics has grown and evolved to be among the healthiest and strongest PCB man- ufacturers in the country. Calumet is fiercely focused on strengthening the domestic elec- tronics industry and solving problems for our North American customers. LaBeau: In 2013, Calumet Electronics restruc- tured to modernize the management team to meet the needs of the technology and job Additive PCB Technology for Next-generation Electronics Flex Talk Feature Column by Tara Dunn, OMNI PCB