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REAL TIME WITH... IPC APEX EXPO 2020 SHOW & TELL MAGAZINE I I-CONNECT007 137 G-11 IPC Department of Defense Task Force, the G-11A, Defense Road Map Task Group, and the G-12, Government Relations Grassroots Partici- pants committee. An active participant in the IPC Cares program, as well as IPC's Workforce Champions initiative, O'Neil was one of a four- member IPC team presenting the initiative to the U.S. White House in 2019. Dr. Ramkumar was recognized for his fre- quent instruction of courses for the elec- tronics packaging industry. A subject-matter expert in robotics, automated manufacturing, and surface-mount electronics assembly edu- cation and research, he was instrumental in establishing the advanced manufacturing and electronics packaging laboratories at RIT. An active participant in technical conference ses- sions at IPC APEX EXPO, Dr. Ramkumar has been a valued instructor on advanced packag- ing, surface mount, soldering, and assembly process topics since 2002, educating hundreds of his industry peers at various workshops and conferences. "The contributions that Dale, Michael, Joe, and Ram have made to IPC and the electron- ics industry cannot be overstated," said John Mitchell, IPC president and CEO. "Their lead- ership and willingness to share their time and expertise with us has been invaluable." S&T IPC Board of Directors: New Officers and Members The Nominating and Governance Committee of the IPC Board of Directors presented officer and mem- ber candidates for election at the 63 rd IPC Annual Meeting on February 4, held in conjunction with IPC APEX EXPO 2020 at the San Diego Convention Center. Officers serve a two-year term, while members serve a four-year term. The newly elected Board officers are: • Board chair: Shane Whiteside, president and CEO, Summit Interconnect • Board vice-chair: Bob Neves, chairman and chief technology officer, Microtek Laboratories China • Secretary/treasurer: Tom Edman, president and CEO, TTM Technologies The newly elected Board members are: • Marc Peo, president, Heller Industries • Hiroyuki Watanabe, executive vice president, NEC Platforms Ltd. • Robert Feuerstein, director, head of manufacturing technology, Continental Automotive GmbH • Steve Pudles, president and CEO, Zentech Manufacturing • Jeanie Wade, sector vice president, operations and sector quality executive, Northrop Grumman Corporation "IPC is privileged to have these officers and direc- tors added to our current slate of Board members. All are active contributors to IPC initiatives, and we look forward to their continued contributions to advancing IPC and the electronics industry," said John Mitchell, IPC president and CEO. In addition to holding Board elections, IPC honored outgoing Board chair, Mikel Williams (Targus), and outgoing members Mike Carano (RBP Chemical Tech- nology) and Joe O'Neil, Green Circuits. All three were honored for many years of service on the IPC Board of Directors. Mikel Williams, Targus