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REAL TIME WITH... IPC APEX EXPO 2020 SHOW & TELL MAGAZINE I I-CONNECT007 147 Receiving Special Rec- ognition Awards for their contributions to D-72 E-Textiles Materials Sub- committee that developed IPC-WP-025—IPC White Paper on A Framework for the Engineering and Design of E-Textiles— were MaryAlice Gill, Jabil Circuit Inc.; Birgit Leit- ner, Propel LLC; Madison Maxey, Loomia; Praty- ush Rai, Nanowear Inc.; Stephanie Rodgers, Apex Mills Inc.; and Sharon Tracy, Steelcase Inc. Receiving a Committee Leadership Award for his contributions to the Technology Solu- tions that developed IPC-WP-026—IPC Tech- nology Solutions White Paper on Blockchain and the Electronics Industry: A Review of the Current State of Blockchain Technology and Its Potential Applications in Electronics Man- ufacturing—was Mike Carano, RBP Chemical Technology Inc. Receiving Special Recogni- tion Awards were Radu Diaconescu, Swissmic; Michael Ford, Aegis Software; Curtis Gross- kopf, IBM Corporation; Craig Lax, Septillion Technologies; and Cameron Shearon, Ray- theon Company. For their leadership of IPC D-32 Thermal Stress Test Methodology Subcommittee that developed IPC-TM-650 Method 2.6.7.2C— Thermal Shock, Thermal Cycle, Continuity, and Microsection—Jim Monarchio, TTM Tech- nologies; Joey Rios, Raytheon Missile Systems; and Jerry Magera, Motorola Solutions received Committee Leadership Awards. For their outstanding contributions to IPC- TM-650 Method 2.6.7.2C, Lance Auer, Conduc- tor Analysis Technologies Inc.; Scott Bowles, Lockheed Martin Space Systems Company; Don Dupriest, Lockheed Martin Missiles and Fire Control; Tim Estes, Conductor Analysis Technologies Inc.; Stefan Gerhold, Atotech Deutschland GmbH; Chris Mahanna, Robisan Laboratory Inc.; and Nick Meeker, Conductor Analysis Technologies Inc., received Distin- guished Committee Service Awards. For their leadership of Hermes Standard Ini- tiative that developed IPC-HERMES-9852—the Global Standard for Machine-to-Machine Com- munication in SMT Assembly—Florian Ritter, ASYS Group, and Thomas Bliem, ASM (Assem- bly Systems) GmbH and Co. KG, received a Committee Leadership Award. For their leadership of 7-31f IPC WHMA- A-620 Task Group that developed IPC/WHMA- A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies, Bud Bowen, Winchester Interconnect; Catherine Hanlin, Precision Manufacturing Company Inc.; George Millman, Raytheon Missile Sys- tems; and Richard Rumas, Honeywell Canada, received Committee Leadership Awards. Receiving Special Recognition Awards were Bob Cooke, NASA Johnson Space Center; Scott Meyer, Collins Aerospace; Garry McGuire, NASA Marshall Space Flight Center; and Deb- bie Wade, Advanced Rework Technology- A.R.T. Receiving Distinguished Committee Ser- vice Awards were Gerald Bogert, Bechtel Plant Machinery Inc.; Zhiman Chen, Zhuzhou CRCC Times Electric Co. Ltd.; Symon Franklin, Cus- tom Interconnect Ltd; Ben Gumpert, Lockheed Martin Missile and Fire Control; Tim Hoover, Raytheon Company; Joseph Kane, BAE Sys- tems; and Jonathan Vermillion, Ball Aerospace and Technologies Corporation. S&T