Issue link: https://iconnect007.uberflip.com/i/1212069
80 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2020 SHOW & TELL MAGAZINE by Nolan Johnson I-CONNECT007 In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and lis- ten to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and pro- vided a different understanding of and take- away from the show. To that end, I noted two distinct themes across all my conversations in San Diego: the first was iterative innovation over technologi- cal disruption, and the second was improved decision-making tools. I come to these themes Trends From the Show: Solder and Software after a process of distillation. Automotive, medical, and IoT were all hot topics, and OEMs are demanding higher densities and increased throughput (those two requirements are at odds with each other). In addition, semicon- ductor companies continue to shrink the silicon into smaller and smaller packages, and higher speed requirements are changing even the plat- ing and manufacturing processes. In this Venn diagram of driving forces, what sits in the very center that's an overlap of all the circles? Con- necting the components to the board and get- ting smarter about the build processes. Interestingly, this is where I saw the most activity in development. In the area of solder and soldering technologies, we heard about new developments in solder paste formula- tions, as well as new methods for applica- tion. The equipment manufacturers are finding