PCB007 Magazine

PCB007-Mar2020

Issue link: https://iconnect007.uberflip.com/i/1221561

Contents of this Issue

Navigation

Page 73 of 119

74 PCB007 MAGAZINE I MARCH 2020 cussed the development potential and pros- pects for the 5G era. The content detailed changes that 5G will bring to the PCB industry, including technical challenges, materials fac- ing major development opportunities, and the production requirements of 5G product solu- tions. This session gave participants a wealth of knowledge and generated a series of ques- tions, which were answered the following day. Orbotech continues its long-standing invest- ment in R&D, holds more than 600 patents, and is staffed with 350 scientists and engineers. The company has made continuous progress in LDI, anti-welding direct imaging for solder mask, AOI, AOS, inkjet printing, laser drilling, CAM and engineering solutions, and Industry 4.0 solutions, among others. Orbotech also announced that, in 2020, six new products would go to market. These new products will be integrated into areas where Orbotech excels, using various unique technol- ogies that are continuously perfected. These products will also provide solutions around the themes of high capacity, high yield, high qual- ity, superior material transfer, and compact, in- tegrated systems. The IC substrates market is also a field in which many industry leaders compete. This is increasingly the case, as China's manufac- turing continues to respond to customer de- mands. As Yole's CEO Jean Christophe Eloy pointed out in his speech, the IC sub- strate market is like a "giant waking from a long sleep." As a result, to- day's supply chain is improving. Arik Gordon, Orbotech's corporate executive VP of growth, also pointed out during his session that IC technol- ogy is affecting the field of PCB design and that this deeply impacts the man- ufacturing process for PCBs. Leading PCB companies, therefore, will face reshuffles due to financial and tech- nical reasons. It is expected that by 2023, the substrate market will reach 10 billion USD, and Orbotech will be ready with a range of solutions to support it. Dream Big In his opening speech, Meny Gantz also said that to achieve dreams, we must first "plant seeds, have faith, and then take action." If we want to make more progress, Gantz said, we must work hard with our partners. In his speech, Charles Shen, chairman and CEO of Avary Holding, also shared examples of cooperation between Orbotech, SAA, HIWIN, and other companies. Shen said that the devel- opment of the PCB industry so far cannot just rely on individual companies but must rely on the entire industry. The speakers for this forum were all industry leaders, and the output in product and revenue created by their companies amount to approxi- mately half of all of China's PCB industry. A Talk With Yair Alcobi To further understand Orbotech's plans and perspective, I spoke with Yair Alcobi, Orbotech's PCB Division president, during the meeting. Tulip Gu: Since 2015, Orbotech has put forward the concept of "the language of electronics" and strived to create the goal of an electronic product language expert. Is this concept given a new meaning this year? Yair Alcobi: The manufacturing of electronic products can be classified as a language be- Participants enjoyed a once-in-a-lifetime gala dinner in a 180-million-year-old cave in the spectacular town of Yangshuo.

Articles in this issue

Archives of this issue

view archives of PCB007 Magazine - PCB007-Mar2020