PCB007 Magazine

PCB007-May2020

Issue link: https://iconnect007.uberflip.com/i/1248324

Contents of this Issue

Navigation

Page 86 of 107

2 µm atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com CupraEtch ® SR8000 Dryfilm and soldermask pretreatment with advanced adhesion performance Excellent dryfilm and soldermask adhesion CupraEtch ® SR8000 is a cupric chloride based microetching system with unique additives. The simple three step process creates uniform roughening of surface at low temperatures. Atotech's cost-effective pretreatment easily drops into existing lines and reliably improves the adhesion of all copper types to industry standard dryfilm and soldermask types. Metal complex free solution benefits in cost-effective waste water treatment. Pic. 1: CupraEtch ® SR8000 etched Cu Metal complex free solution

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-May2020