60 PCB007 MAGAZINE I JUNE 2020
ESA Approval for Ventec VT-901
Material in ACB Belgium Rigid and
Flex-Rigid Production E
Ventec International Group Co. Ltd. is pleased
to announce that its VT-901 polyimide material
is now fully qualified by ESA in ACB Belgium's
manufacturing process for rigid and rigid-flex
polyimide PCBs and HDI PCBs.
Raytheon Technologies Supporting
the Supply Chain E
To support its small business suppliers, Ray-
theon Technologies formed a Small Business
Supplier Stimulus Team focused on coordinat-
ing support to its supply base. This team brings
together cross-functional members from each
of the company's businesses, creating a hub of
knowledge, expertise, and experience.
Atotech to Present at the ECTC
Virtual Conference 2020 E
Atotech, a leading global provider of electro-
plating and surface-finishing chemicals and
equipment for PCB, semiconductor advanced
packaging, and dual-damascene applications,
will participate in this year's IEEE 70
th
Elec-
tronic Components and Technology Conference
(ECTC). The virtual conference will be held
in June.
MacDermid Alpha Releases Complete
Semi-Additive Process for IC Substrates
and Panel-Level Packaging: Systek SAP E
MacDermid Alpha Electronics Solutions, a glob-
al leader in specialty materials for electronics,
announces the release of Systek SAP. The Mac-
Dermid Alpha Systek SAP is a family of high-
performance build-up processes for IC sub-
strate RDL that provide multiple process flows
for different materials as well as revolutionary
technology innovations in the desmear, condi-
tioning, activation, and metallization steps.
Rogers Corporation Keeps
Materials Moving E
The I-Connect007 editorial team spoke with
Roger Tushingham of Rogers Corporation about
the company's current priorities with every-
thing that's been changing recently, including
his perspective on the distributing and manu-
facturing trends he sees as a global supplier.
Language of Electronics: HENSOLDT and
Nano Dimension Achieve Breakthrough
in Electronics 3D Printing E
Sensor solutions provider HENSOLDT, togeth-
er with additively manufactured electronics/
printed electronics provider Nano Dimension,
has achieved a major breakthrough on its way
to utilizing 3D printing in the development
process of high-performance electronics com-
ponents.
Key Considerations for Your Next
Direct Imaging System E
In this column, Orbotech West DI expert Rick
Jackson provides a guide detailing which is-
sues should be considered when choosing a
new DI system. As your PCB manufacturing
company considers a new DI system, here are
some key considerations to keep in mind.
Elsyca Offers Free White Paper on
How Plating Simulation Raises Yield
and Profitability E
What if the PCB pre-production engineer could
upfront identify problem areas for the pattern
plating and apply auto-intelligent copper bal-
ancing, as part of the CAM process to provide
a right-first-time panel layout for production?
