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Design007-July2020

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88 DESIGN007 MAGAZINE I JULY 2020 SEMI FlexTech Launches Three New Projects to Advance Flexible Hybrid Electronics E SEMI FlexTech announced the launch of three projects to accelerate sensor and sensor system innovations for new applications in industries including healthcare, automotive, industrial, and defense. Matrix Electronics Expands Flexible Circuit Materials Manufacturing E Matrix Electronics has completed a new, larger flexible circuit materials conversion center at its Santa Ana, California, location. This facil- ity will accommodate the company's growth and improve productivity with state-of-the-art automated processing equipment. MFS Technology Opens Fourth Manufacturing Plant E MFS Technology recently opened its fourth manufacturing plant. The new factory, which specializes in high-precision flexible printed circuit boards and electronics components assembly, is in Yiyang city's Economic Devel- opment Zone, Hunan, China. ROARTIS Introduces Fast Cure Materials for Printed Electronic Applications E ROARTIS has developed a range of anisotro- pic conductive adhesives, used in the assem- bly of fine pitch RFID antennas, where reliable interconnections of the RFID tab onto the RFID antenna can be realized in a matter of seconds. IQ-BOND 5976-ACE addresses the economic challenges of printed electronics, in combi- nation with the high throughput processing requirements and long-term reliability require- ments. The iNEMI 2019 Roadmap: Flexible Hybrid Electronics E The emerging trend for "electronics on every- thing, everything with electronics" was the theme of iNEMI's webinar presentation of the highlights of its recently published Flexible Hybrid Electronics Roadmap Chapter, deliv- ered by Girish Wable, senior engineering ser- vices manager with Jabil. EPTE Newsletter—Next-Generation Flex Circuits: Elastic E Wearable electronics and health care devices brought a need for elastic, flexible circuits. Dominique Numakura explores next-genera- tion flexible circuits, starting with elastic cir- cuits. NextFlex Secures Seven Years of Funding in Agreement with Air Force Research Laboratory E NextFlex, America's Flexible Hybrid Electron- ics (FHE) Manufacturing Innovation Institute, announced that it secured seven years of gov- ernment funding worth up to $154M in a cost- sharing agreement with the Air Force Research Laboratory (AFRL). EastPrint Expands Offerings for Printed Electronics to Include CNT Hybrids E CHASM Advanced Materials Inc. inventor of AgeNT formed a partnership with Eastprint, a premier printed electronics provider serving clients across North America. As an affiliate of the CHASM Preferred Integration Partner (PIP) Program, Eastprint secured access to CHASM's line of transparent conductive printed electron- ics materials to offer their customers greater choice in high optoelectronic performance transparent conductors.

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