88 DESIGN007 MAGAZINE I JULY 2020
SEMI FlexTech Launches Three New
Projects to Advance Flexible Hybrid
Electronics E
SEMI FlexTech announced the launch of three
projects to accelerate sensor and sensor system
innovations for new applications in industries
including healthcare, automotive, industrial,
and defense.
Matrix Electronics Expands Flexible
Circuit Materials Manufacturing E
Matrix Electronics has completed a new, larger
flexible circuit materials conversion center at
its Santa Ana, California, location. This facil-
ity will accommodate the company's growth
and improve productivity with state-of-the-art
automated processing equipment.
MFS Technology Opens Fourth
Manufacturing Plant E
MFS Technology recently opened its fourth
manufacturing plant. The new factory, which
specializes in high-precision flexible printed
circuit boards and electronics components
assembly, is in Yiyang city's Economic Devel-
opment Zone, Hunan, China.
ROARTIS Introduces Fast Cure Materials
for Printed Electronic Applications E
ROARTIS has developed a range of anisotro-
pic conductive adhesives, used in the assem-
bly of fine pitch RFID antennas, where reliable
interconnections of the RFID tab onto the RFID
antenna can be realized in a matter of seconds.
IQ-BOND 5976-ACE addresses the economic
challenges of printed electronics, in combi-
nation with the high throughput processing
requirements and long-term reliability require-
ments.
The iNEMI 2019 Roadmap: Flexible
Hybrid Electronics E
The emerging trend for "electronics on every-
thing, everything with electronics" was the
theme of iNEMI's webinar presentation of the
highlights of its recently published Flexible
Hybrid Electronics Roadmap Chapter, deliv-
ered by Girish Wable, senior engineering ser-
vices manager with Jabil.
EPTE Newsletter—Next-Generation
Flex Circuits: Elastic E
Wearable electronics and health care devices
brought a need for elastic, flexible circuits.
Dominique Numakura explores next-genera-
tion flexible circuits, starting with elastic cir-
cuits.
NextFlex Secures Seven Years of
Funding in Agreement with Air Force
Research Laboratory E
NextFlex, America's Flexible Hybrid Electron-
ics (FHE) Manufacturing Innovation Institute,
announced that it secured seven years of gov-
ernment funding worth up to $154M in a cost-
sharing agreement with the Air Force Research
Laboratory (AFRL).
EastPrint Expands Offerings for Printed
Electronics to Include CNT Hybrids E
CHASM Advanced Materials Inc. inventor of
AgeNT formed a partnership with Eastprint,
a premier printed electronics provider serving
clients across North America. As an affiliate of
the CHASM Preferred Integration Partner (PIP)
Program, Eastprint secured access to CHASM's
line of transparent conductive printed electron-
ics materials to offer their customers greater
choice in high optoelectronic performance
transparent conductors.
