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PCB007-July2020

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74 PCB007 MAGAZINE I JUNE 2020 That's where WUS sees VeCS moving to now; initially, the thought was VeCS could somehow replace all types of interconnects in the ear- ly stages, and that's what many people were considering. That's not going to be the case, at least from what we see. That will be used as an application tool with HDI with through- hole and most likely in combination with those moving forward. Johnson: Theoretically, a board could be using VeCS, HDI, and traditional at the same time— three different topologies—depending on what you need? Dickson: I expect that. If you look at where the industry is going, as well as the roadmap of system-on-chip and FPGA-type technologies, you're trying to do more and more on organ- ic substrates outside of the PCB. That's going to work well as an enabling process to lever- age technology and get it to the forefront for performance now. Right behind that should be some level of value engineering, where those systems can be utilized and moved into the PCB. That's where some of the transformation- al value engineering will come. You'll enable Rethinking Interconnects With VeCS Technology Feature Interview by the I-Connect007 Editorial Team Nolan Johnson and Happy Holden chat with Joe Dickson of WUS about the work he's do- ne with VeCS, the continuing development of the technology, and the potential impact it can have on the manufacturing floor. Nolan Johnson: Joe, you recently posted some information on interconnect strategies. Joe Dickson: Yes. The last thing I posted on that topic was regarding HDI, VeCS, and other in- terconnects in one PCB, and that's the evolu- tion of VeCS. Happy can talk to the PCB, HDI, and the idea that HDI would be the replace- ment of vias early in the development. There were some PCBs; it did happen where through- hole connections were no longer required. But in many applications, HDI became a collabora- tive tool to be utilized in specific locations, and the rest of it maintained a relatively conven- tional product. And that's where the highest level of benefits came, both from value engi- neering and the standpoint of cost reductions with performance.

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