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PCB007-July2020

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JUNE 2020 I PCB007 MAGAZINE 81 nologies spanning broadband connectivity, smart devic- es, cloud and edge computing, big data analytics, AI, IoT, augmented and mixed reality, and blockchain. Jio's vision is to enable a digital India for 1.3 billion people and busi- nesses across the country, including small merchants, micro-businesses, and farmers so that all of them can en- joy the fruits of inclusive growth. (Source: Qualcomm) not only are you using an interconnect with the correct impedance on that signal, but you also shielded it from any parasitics, RF, or any type of power radiation coming from anywhere else in the PCB. Three sides of that signal interface are shielded. And if you use VeCS on every oth- er slot of every other row, now you shielded it on the other side, and you almost have a full Faraday cage going down inside the PCB. Again, I know people who are trying to put multiple holes in BGAs and do HDI in through- holes, and the through-holes are only to create shields. But no matter what they do, they leave pockets of the anti-pad open, and in that area, the higher speeds are going to pick up that par- asitic signaling. The VeCS is already blocked and part of that structure. That's a unique ap- plication—shielding—which looks like it's go- ing to be valuable for RF, but it's also valuable for digital signals. Johnson: Joe, thanks for your time. Dickson: Great. Thank you. PCB007 Related article: The Current State of VeCS Technology, PCB007 Magazine, March 2020, page 94. tive today to utilize it in a conventional PCB. But that doesn't mean it won't be there two generations from now. I doubt if VeCS is going to become obsolete any time soon. It's some- thing that will be desirable for a flat signal in a vertical plane, which potentially can be ad- vantageous to any kind of radial interconnect. When we first started this technology, I had no idea about the significant issues that ground isolation for differential signals and the problems that would be coming with the next generation SI performance. Typically, you have HDR through-holes, and you have a dif- ferential signal coming off the BGA that's go- ing down into the PCB. If you're using HDI, you're using multiple layers to connect that, and you're building ground shields around it. But those ground shields are not solid. They're spaced and based at the pitch of the HDI or the BGA circuits or paths. The advantage of VeCS is that it doesn't have to be like that. You can leave the slot com- pletely solid all the way around and discon- nect it only where there are two differential sig- nals. Say you're going down to layer eight and stop the signal routing at layer eight, but that ground goes all the way through the PCB. Now, Reliance Industries Limited and Jio Platforms Limited announced that Qualcomm Ventures, the investment arm of Qualcomm Incorporated, has committed to invest up to ₹ 730 crore in Jio Platforms at an equity value of ₹ 4.91 lakh crore and an enterprise value of ₹ 5.16 lakh crore. Qualcomm Ventures' investment will translate into 0.15% equity stake in Jio Platforms on a fully diluted basis. The investment will deepen the ties between Qualcomm and Jio Platforms to support Jio Platforms on its journey to rollout advanced 5G infrastructure and services for Indian customers. Jio Platforms, a majority-owned subsidiary of Reliance Industries, is a next-generation technology platform fo- cused on providing high-quality and affordable digital services across India with more than 388 million sub- scribers. Jio Platforms has made significant investments across its digital ecosystem, powered by leading tech- Qualcomm Invests in Jio

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