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JUNE 2020 I PCB007 MAGAZINE 61 having this improved control of sensitive concentration in criti- cal processes. Improvements in fluid dynam- ics, transportation, automation, and control have led to the next generation of Uniplate Cu—IP3. This is an improved machine for finer structures, blind vias, and modified semi-additive process- es, or mSAP (Figures 5 and 6). This new product targeting L/S (lines/spaces) capability down to 20-micron traces and spaces. Some of the automation features are automatic cleaning sequenc- es that protect the operator and guarantee the machine is prop- erly set up for products with fine structures (Figure 7). Horizon Horizon is the other long- standing series of horizontal machines. Not intended for met- allization, these provide for the bonding enhancement, surface treatment, and metal stripping with the Horizon Bondfilm, Ho- rizon NovaBond, Horizon Pal- laStrip. This series of equipment is used for surface treatment technology or STT (Figure 8). For the final finishing of PCBs, Atotech provides the immersion tin system solution with the Ho- rizon Stannatech equipment and process. Polygon (New Product Line) New for 2019, and manufac- tured in Atotech's China plant, the Polygon series is engineered for higher through-put of thin materials and larger PCBs with patented fluid bar technology for state-of-the-art solution ex- change on the panel surface in BMVs and THs. With the tech- Figure 5: Uniplate has extensive automation and control features that provide stable and tight process parameters. Figure 6: The advanced substrate's need for conformal panel plating and copper filling are provided by the Cu IP2 and Cu IP2 advanced. In 2020, the Cu IP3 series was introduced for horizontal pattern plating for (a)mSAP applications. Figure 7: Advanced automation includes automatic cleaning and equipment preparation, ensuring that these sensitive processes have the proper conditioning.