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Design007-Aug2020

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110 DESIGN007 MAGAZINE I AUGUST 2020 1 Just Ask Happy: Stacked Microvia Reliability Issues E We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, cover- ing technology, the world- wide fab market, and every- thing in between. One of the topics that read- ers most often ask about is microvia reliability. 2 Chris Hanson: New Ventec IMS Dielectrics Rated for Higher Temps E Andy Shaughnessy recently spoke with Chris Hanson, global head of IMS Technol- ogy for Ventec International Group. During their con- versation, Chris discusses his group's recent efforts to create new IMS materials, with a focus on dielectrics. 3 Avishtech Announces Gauss Stack and Gauss 2D PCB Modeling Software E Avishtech Inc.—a sim- ulation-based design software provider, head- quartered in San Jose, California—announced the introduction of its Gauss suite of software for the design and simu- lation of PCB stackups and transmission lines used in PCBs and semiconductors. 4 Beyond Design: Split Planes—Reprise E A high-speed digital signal crossing a split in the refer- ence plane impacts at least three aspects of design integ- rity: signal quality, crosstalk, and EMI. Barry Olney reviews the two common solutions, plus introduce a third optimal solution for high-speed design. Happy Holden Chris Hanson Barry Olney

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