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112 SMT007 MAGAZINE I SEPTEMBER 2020 Michigan Tech University, with the help and software from ANSYS (Sherlock), will do the statistics and attempt to correlate results with simulation. The completion time is estimated at nine months, and the report/results will be made public once finished. Final Q&A The wealth of knowledge and experience gen- erously shared by the presenters provided an excellent background for a panel discussion on weak-interface stacked microvia reliability, mod- erated by John Perry. Although the attendees did not have the opportunity to network and catch up on old times, the last Q&A roundtable session was robust. The success of this virtual confer- ence was confirmed by the scheduled 30-minute session lasting over 90 minutes with abundant conversations on these topics and additional questions. The only thing missing from this vir- tual event was face-to-face networking from pre- vious IPC Reliability Forums (Figures 1 and 2). I can't speak for everyone who attended, but I believe it was an extremely rewarding experience for all 150+ participants. IPC also provided the entire two-day transcript for all attendees. SMT007 Happy Holden has worked in printed circuit technology since 1970 with Hewlett-Packard, NanYa/Westwood, Merix, Foxconn, and Gentex. He is currently a technical editor with I-Connect007. Figure 1: (Top) 2017 Reliability Forum. Figure 2: (Right) 2018 Reliability Forum.

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