SMT007 Magazine

askus@indium.com Learn more: www.indium.com/avoidthevoid/SMUS ©2020 Indium Corporation High-Reliability Alloys, Jetting Paste, ...and more! Defects Eliminated Reliability Delivered NEW Learn more: DENDRITIC GROWTH VOIDING SOLDER BEADING HEAD-IN-PILLOW NON-WET OPENS NON-WET OPENS AVOID: SOLDER BEADING DENDRITIC VOIDING INSUFFICIENT SOLDER DEPOSITS CRACKING

• SMT007 Magazine – September 2020
• Featured Content — Reliability
• Additional Content
• Column — Racing Toward Reliability
• Feature Interview — Robustness Is Not the Same as Reliability
• Feature Column — Reliability Starts at the Bottom
• Short — Eight Ways to Create Transformational DNA in Your Organization
• Feature Interview — Ensuring Definitive Manufacturing Reliability
• Short — Integrated Lightwave Electronics
• Feature — The Value of the Last One Percent
• MilAero007 Highlights
• Interview — Improving Tech Support During a Pandemic
• Feature Interview — How to Find Reliability in Box Build Assembly
• Feature Interview — Monsoon Solutions: Achieve Greatest Reliability With Optimized Panelization, Part 1
• Electronics Industry News and Market Highlights
• Interview — 90% Solder Dross Recovery: Eliminate Waste, Save Money
• Supplier Highlights
• Article — Can All Liquid Fluxes Work Well on A Reflowed OSP Pad Finish?
• Short — How Airplanes Counteract St. Elmos's Fire During Thunderstorms
• Column — How to Audit OEM-EMS Assembly Capability, Part 1
• Short — Lean Digital Thread: Data-Driven Decisions and Micro-Solutions in Manufacturing
• Column — PCB Rework of 0201 Packages
• Special Event Coverage from the 2020 IPC High-Reliability Forum
• 2020 IPC High-Reliability Virtual Forum Review
• Denny Fritz Unpacks Weak Interface and Stacked Microvia Reliability
• Gerry Partida Emphasizes Current Concerns Over Microvia Failures
• Top 10 Editor's Picks from SMT007.com
• Career Opportunities Section
• I-007e Educational Resource Center
• Advertiser Index and Masthead
• Back Cover