Issue link: https://iconnect007.uberflip.com/i/1285883
SEPTEMBER 2020 I DESIGN007 MAGAZINE 11 and effort. Joe Fjelstad explains why, until re- cently, thermal issues had been the Rodney Dangerfield of PCB issues. And we have an excerpt from the newest release in The Print- ed Circuit Designer's Guide to... book series, Thermal Management: A Fabricator's Perspec- tive by Anaya Vardya of American Standard Circuits. We also bring you columns from our regular contributors Barry Olney, Alistair Little, Kelly Dack, John Talbot, Patrick Crawford, Domi- nique Numakura, and Bob Tise and Matt Ste- venson. And we have the second half of our fab notes conversation with Jen Kolar and Dan Warren of Monsoon Solutions. I wrap up most of my September columns by mentioning which trade shows and conferences I'll be attending. But for now, I'm much more likely to see you all in a chat room for a webinar. Speaking of webinars, if you haven't already signed up for Joe Fjelstad's nine-part Flexible Circuit Technology Workshop, now is the time to do so! See you next month. DESIGN007 Andy Shaughnessy is managing editor of Design007 Magazine. He has been covering PCB design for 20 years. He can be reached by clicking here. tion. For instance, is the temperature of a via related to the current going through it? You'll find out in this issue. This month, we start by interviewing Mike Jouppi, a pioneer in PCB thermal management. Mike was the champion behind the update of the old IPC current-carrying tables, which lead to IPC-2152. We also have a conversation with Johannes Adam and Doug Brooks, co-authors of PCB Trace and Via Currents and Tempera- tures: The Complete Analysis, who discuss the principles of thermal design and Johannes' new TRM software tool. Doug also brings us an article explaining why trace temperature should not be equated with current density, and Johannes has a feature discussing why thermal engineers should not trust datasheets. Mark Thompson answers five common ques- tions about improving thermal management. Ventec's Alun Morgan discusses the compa- ny's IMS laminates and how they can help mit- igate many thermal concerns. Tim Haag shares some advice about how designers can "stay out of the fire." We have a conversation with Jeff Brandman of Aismalibar North America, who discusses the heat dissipation properties of the company's thermal laminates. John Par- ry of Mentor, a Siemens Business, shares some insight into the FloTHERM CFD software tool and how it can save thermal engineers time