86 PCB007 MAGAZINE I SEPTEMBER 2020
RBP Releases Circutek CC-720 PTH Acid
Cleaner Conditioner E
Circutek CC-720™ is an acidic cleaner/condi-
tioner for use in the electroless copper metal-
lization process in the PCB industry. It is for-
mulated to remove fingerprints, light soil, and
other contaminants from copper foil.
Frontline Launches InShop Data
Analysis Software E
Frontline, a software PCB solutions subsidiary
of Orbotech, launched InShop®, a new Industry
4.0 software solution for PCB manufacturers.
InShop will provide PCB manufacturers with a
fast and insightful analysis of data from across
the production floor to monitor operations and
detect anomalies in near real-time.
Limata's Innovative LUVIR Technology
Speeds up PCB Solder Mask Production E
Limata, a provider of laser direct imaging systems
for PCB manufacturing and adjacent markets,
announced the availability of its proprietary and
field-proven LUVIR Technology® on all X-series
model types. This unique LDI technology signifi-
cantly increases the speed of solder mask direct
imaging at a lower total cost of ownership (TCO).
Nova Drilling and Fabrication Expands
Capabilities With Excellon Laser Systems E
Nova Drilling and Fabrication Services based in
Milpitas, California, expands laser capabilities
with the addition of two COBRA-II Hybrid UV
and CO2 laser systems from Excellon.
Atotech Expands Its Software Capabilities E
Atotech, a global provider of specialty surface-
finishing solutions, announced it signed a de-
finitive agreement to acquire Visutech Plating,
along with certain assets from its partner com-
pany, koenig-pa GmbH.
MacDermid Alpha Releases Systek ETS
1200 Pattern Plating Metallization for
Embedded Trace Substrates E
MacDermid Alpha Electronics Solutions, a
global leader in specialty materials for elec-
tronics, announced the release of Systek ETS
1200, the latest addition to the Systek family of
IC substrate manufacturing solutions.
Hitachi Chemical Launches Mass
Production of 5G-Compatible Printed
Wiring Board Material E
Hitachi Chemical Co. Ltd. launched mass pro-
duction of "MCL-HS200," an advanced func-
tional laminate material for printed wiring
boards, with low transmission loss and low
warpage properties required for semiconduc-
tor packaging substrates used in such fields
as fifth-generation mobile communications
systems (5G), advanced driver-assistance sys-
tems (ADAS)*1, and artificial intelligence in
March.
Rogers Introduces RO4450T
Glass-Reinforced Thermoset
Multi-Thickness Bondply E
Wireless circuit designers can now enjoy a
true breakthrough with Rogers Corporation's
RO4450T™ bondply. This product offers design-
ers a spread glass-reinforced bonding material
in seven thickness options ranging between
0.0025" (0.064mm) and 0.006" (0.152mm),
greatly improving flexibility for high multilayer
board count designs.
Seacole Specialty Chemical Installs
Rooftop Solar Array E
Seacole Specialty Chemical activated its new
200 megawatt-hour rooftop solar array at its
corporate offices in Plymouth, Minnesota.
