Issue link: https://iconnect007.uberflip.com/i/1293772
OCTOBER 2020 I SMT007 MAGAZINE 45 thought where development was needed, and we focused on that. Shaughnessy: When did you start working on this? Rice: The latest edition of the International Tech- nology Roadmap for Semiconductors (ITRS) was in 2014, and a lot of it had to do with the semiconductor fab side of things. That's when Bill Chen and Bill Bottoms decided to lead this effort to create the packaging portion of this current HIR roadmap. As semiconductor technology started to become less available to the mass market because the expense of fabs was going way up, only the richest companies could really afford it. Everyone saw that pack- aging would be increasingly used to integrate the various IP blocks inside of a subsystem. It's not just the integration on a PCB; it's driving it closer and closer in proximity inside a package. Johnson: What can you tell us about your pre- sentation? Rice: Urmi Ray and I are co-chairs. We have con- tributors from Intel, Bosch, Fraunhofer, as well as Frank Bertini for Velodyne, Professor Yu from Arizona State, and Klaus Pressel from Infineon. Our new members are Veer from NXP, Vikas also from ASE, and Andreas Grassmann from Infi- neon. You can see it's very focused around semi- conductor to a certain extent, and there's a little bit into the Tier 1 area like with Bosch. That's the scope of the inputs we've received so far. Our chapter is organized into five sections. It's connectivity and communications, in addi- tion to the processor roadmap, which includes ADAS, infotainment, MCU, and autonomous driving sensors. It's really three main areas: functional safety, reliability—which the peo- ple from Bosch did a great job at contribut- ing—and electric powertrain. This is what I talked about before as far as the growth driv- ers, autonomous driving, or ADAS systems, as well as powertrain and electrification of the powertrain specifically. Regarding our executive summary, it's a high-growth market. We're all interested in it. Autonomous driving and electric powertrain are causing a lot of disruption for system archi- tecture and even the physical drive architec- ture of the car going from internal combustion to electric powertrains. As we've talked about what impacts the sys- tem architecture, we've also introduced highly complex packaging for processors because the speed at which some of the new fab nodes that are coming in is unprecedented in the acceptance in automotive systems. Typically, they wanted to see fab notes that were mature and completely wrung out from a reliability standpoint. Now, because of the processing chal- lenges, you see much more of an open mind