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Design007-Oct2020

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60 DESIGN007 MAGAZINE I OCTOBER 2020 Feature Interview by the I-Connect007 Editorial Team Nolan Johnson and Andy Shaughnessy recently spoke with Jeff Demmin of Keysight Technologies, who breaks down the work his team has done on the Aerospace and Defense Chapter of the Heterogeneous Integration Roadmap (HIR). Nolan Johnson: Jeff, IEEE pointed us in your direction to discuss your chapter of the HIR. What's your background and involvement with the HIR? Jeff Demmin: My background is broadly in semiconductor packaging. From 2015 to 2019, I worked for a company called Booz Allen Ham- ilton, which is a major government contractor. In that role, I supported leading-edge techni- cal research related to packaging and hetero- geneous integration, primarily at DARPA. I also have some background in the publishing world. With my long career in packaging and my more recent experience specifically in the mili- tary and aerospace arena, I got tapped to work on the Aerospace and Defense Chapter of the HIR. I know most of the people involved in it, and I like to participate in industry activities, so it was an obvious match. Also, I want to be clear that my involvement is as the co-chair of this committee on the HIR and is not associ- ated with my work for Keysight Technologies, nor does it represent the company's thoughts. I do this mostly in my spare time, which is prob- ably true of many of the people participating. I jumped in relatively early a few years ago, shortly after the HIR effort was begun. It was created to continue the work of the broadly used International Technology Roadmap for Semiconductors (ITRS), which had been around for a couple of decades, driving the node-based metrics for how the semiconductor industry should move ahead. But with Moore's Law running out of steam, mostly meaning that it's too expensive to keep it going, the HIR was one thrust that arose from the demise of the ITRS. Johnson: The rationale makes sense. There may be a portion of your overall design that requires cutting-edge fabrication technologies but forcing your entire design to adhere to that The Aerospace and Defense Chapter of the HIR

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