PCB007 Magazine

PCB007-Nov2020

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atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com Printoganth ® MV TP2 Excellent throwing power e-less Cu with less dummy pla ng • Excellent throwing power into BMVs • Reduced process costs thanks to less dummy plating needed • Low bath initiation: 0.2 dm² c.b./L for 10min • Bath loading factor: ≥ 0.1 dm² c.b./L • Predictable and tunable deposition rate • High volume production: 0.5 μm in 20 min • Low deposition enables fine line & high frequency production: 0.25 μm in 10 min • Enhanced surface roughness for improved dry film adhesion • Ideal for mixed production such as SAP with amSAP • Stabilizer analysis available for improved process control • Drop-in system Features and benefits Excellent throwing power Enhanced micro roughness due to adjusted Stabilizer-Moderator system 10 µm BT with Cu clad BMV 90/80 µm Dwell 20 min 1 µm ABF GX-92R Dwell 10 min Throwing power > 80% Min. thickness in BMV > 0.3 µm

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