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PCB007-Nov2020

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NOVEMBER 2020 I PCB007 MAGAZINE 43 Tourné: That's something we're going to look at. First, we want to mature the technology to bring it to market. Second, we're working with Schmoll, which is fairly local to me, on some different proj- ects, but laser is definitely one of them. We use laser for the smaller type slots. That's definitely on the agenda. It has to pay off. That's why it's so difficult to break that to go to the big HDI shops where they're heavily in- vested in it. They do cellphones, for ex- ample, and they don't want to discard their investment. It won't happen over- night. It will not disappear. It's like the strategy is creating demand. If there are multiple designs out there, and we get reference designs for laptops and those parts, we can quote them. We are competitive with HDI cost-wise. That's creating demand. It's like the chicken and egg. Before we get to design, we need suppliers to get the real push. Holden: I ran into that same problem. Once OEMs started using HDI, the design was proprietary. I started redesigning complex through-hole boards to HDI that were proprietary that we could then use as a reference. The problem with OEMs is if they invest in all this and get a big advantage, they suddenly slap secrecy on it because they don't want to educate everybody. You do, but they don't. You can't use my design. You have to have your own reference designs, and one of them went from 16-layer multilayer to a 10-lay- er MCM to a six-layer HDI—the same schemat- ic different ways of putting the chips together to take advantage of the density. But something like that would be fun to have the fourth generation of that design instead of a six-layer HDI, it was the one lamination four-layer VeCS. Tourné: We take those real designs, six lamina- tion cycles, and HDI back to a single lamina- tion now. Holden: Getting the word out to OEMs isn't al- ways that easy. A lot of the future of these tech- nologies depends on the OEMs adopting them and pushing from the top down. Tourné: They take a more direct marketing ap- proach where they call a customer, get in front of them, and present the technology. Holden: But the HIR is a big thing among the OEMs. Fortunately, this provides the bridge into the PCB industry meeting their demands. Tourné: I'd love to get out on stage and pres- ent the technology, but it's more difficult due to COVID-19. Holden: Do you have a set of slides for a fab- ricator to show an OEM when you first intro- duce it to an OEM? Tourné: We do. The software houses are step- ping up as well, which is great; they call it a workaround. They might not have all the fan- cy tools around VeCS, but you could apply ev- erything. It takes a bit more work to create the symbols, but you can do it. Design rule checks are in place, which is key. Matties: Thank you. This was great. We appre- ciate all your time. Dickson: Have a good day. Tourné: Thanks. PCB007 Thanks to NextGIn and WUS for the illustrations in this article. A webinar will be presented on Nov. 30, 2020 at the WECC-HKPCA Conference. Micro-machined power—VeCS. The basic VeCS element shown from the bottom side using two traces and a power connection at the far end of the slot. Terms for the wide structures are cross route and bottom route.

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