SMT007 Magazine

SMT007-Dec2020

Issue link: http://iconnect007.uberflip.com/i/1313710

Contents of this Issue

Navigation

Page 83 of 99

84 SMT007 MAGAZINE I DECEMBER 2020 7. TEC-QT/2014/268 (06/05/2015): PCB and assembly technologies roadmap for space applications. 8. ECSS-Q-ST-70-12C (14/07/2014): Design rules for printed circuit boards. 9. ECSS-Q-ST-70-60C (01/03/2019): PCB qualification and procurement. 10. IPC-WP-023 (01/05/2018): IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance—Via Chain Continuity Reflow Test, The Hid- den Reliability Threat. Editor's note: This paper was first presented at the IPC APEX EXPO 2020 Technical Conference and published in the 2020 Technical Conference Proceedings. Maarten Cauwe, imec-Cmst, Zwijnaarde, Belgium Bart Vandevelde, imec, Leuven, Belgium Chinmay Nawghane, imec, Leuven, Belgium Marnix Van De Slyeke, ACB, Dendermonde, Belgium Erwin Bosman, ACB, Dendermonde, Belgium Joachim Verhegge, ACB, Dendermonde, Belgium Alexia Coulon, Thales Alenia Space, Charleroi, Belgium Stan Heltzel, European Space Agency, ESTEC, Noordwijk, The Netherlands Acknowledgment The work in this article is performed in the frame of an ESA GSTP project (ESA Contract No.: 4000122931/18/NL/LvH). The authors would like to thank Jason Furlong from PWB Interconnect Solutions and all members of the ESA PCB/SMT working group for their valu- able insights and feedback. SMT007 References 1. "Xilinx Virtex-5QV Update and Space Roadmap," Xilinx, SEFUW2016, ESA/ESTEC. 2. "ST65nm hardened ASIC technology for space appli- cations," STM, ESCCON2016, ESA/ESTEC. 3. "GR740 - Next Generation Microprocessor (NGMP)," Cobham Gaisler, FPDs 2015, ESA/ESTEC. 4. "The European One-Stop Shop for CCGA: From Column Manufacturing to Column Assembly on LGA or Re-Assem- bly on Used LGA," HCM Systrel, EMPS-7, Portsmouth, U.K. 5. "Ball-grid array reliability assessment for aerospace applications," R. Ghaffarian, N.P. Kim, Microelectronics Reliability, 39 (1999), 107–112. 6. "Reliability of Area Array Packages With 1500–2500 I/ Os," R. Ghaffarian, NEPP report. Bill Horner, the founder of The Test Connection Inc. and a well-respected engineer, passed away on September 21, 2020. He was 81 years old. Bill received a bachelor of science degree in engineering, physics, and com- puter science from Loyola College and a diploma from Baltimore Technical Insti- tute in electronics, broadcast engineering, and industrial electronics. Before founding The Test Connection Inc. in 1980, Bill had advanced through 20 years in senior ATE and quality management positions at major corporations, such as GenRad, Bendix, Westinghouse, Plantronics, and Hydranautics. The Test Connection Inc., located in Hunt Valley, Maryland, has been a reli- able source for quality test engineering solutions. In light of the growing trend of outsourcing test engineering products and services, Bill founded TTCI and built this test engineering service with the purpose of responding to this need. He proudly served as a member of the U.S. Army in the special Nike Hercules Fire Control Unit. As an active participant in the ATE community, Bill presented papers and co-sponsors events at major ATE seminars and user group meet- ings. He was a strong advocate for the local Capitol Chapter of SMTA. Bill was born Wilbert August Horner on September 17, 1939, in Baltimore, Maryland. He was preceded in death by his wife, Margaret Horner. He is survived by Bert Horner and his wife Monica, Michele Reichart and her husband Shawn, and grandchildren Alex, Leah, Addison, and Cooper. Test Connection's Bill Horner Remembered Bill with his loyal Bernese Mountain Dog, Sawyer.

Articles in this issue

Archives of this issue

view archives of SMT007 Magazine - SMT007-Dec2020