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JANUARY 2021 I SMT007 MAGAZINE 77 5 Lean Digital Thread: Micro-Solutions— Solving One Challenge at a Time E Sagi Reuven jumps back to the manufacturing floor and shares his thoughts on the role of a manufacturing execution sys- tem (MES), reporting, and ana- lytics. Reuven describes in more detail the micro-solutions concept and why he thinks it will make a huge impact on achieving productivity excellence. 6 Free Download: Leverage Smart Data Analytics for Industry 4.0 Factories E Learn how to leverage your manufacturing data with The Printed Circuit Assembler's Guide to… Smart Data: Using Data to Improve Manufactur- ing—the latest title in our I-007e library. 7 Foundation of the Future: IPC Students Chapters Gear Up for Competitions E As colleges and universities continue to adapt to remote and virtual learning, the IPC Education Foundation has also adapted to support its IPC stu- dent members and 38 IPC stu- dent chapters across the U.S. With the increase in distance learning, Aaron Birney describes how the IPCEF has had to adapt its initiatives for student chapters. 8 IPC Launches IPC-CFX Self-Validation and Equipment Qualification Systems E IPC has introduced IPC-CFX Self-Validation and Equipment Qualification Systems. The IPC- CFX Self-Validation System is a cloud-based test bed for equipment vendors and manufac- turing facilities to self-validate CFX messaging. 9 Training Is Hard, But It's Also Soft E There is a disconnect in many manufacturing companies. This article is not about that discon- nect, but rather a topic that gets clouded and the objec- tives made more difficult by that prevalent disconnect. Business owners, vice presidents, and operational executives are expected to have a vision for the company strategy. But what is not always fully known is the broad strokes of how to get there. J CyberOptics to Present 'Metrology and Inspection' Paper at Virtual IEEE PAINE Conference E CyberOptics® Corp., a leading global devel- oper and manufacturer of high-precision 3D sensing technology solutions, was scheduled, at press time, to present at the Virtual IEEE International Con- ference on Physical Assurance and Inspection of Electronics (PAINE) in December. Aaron Birney Jahr Turchan Sagi Reuven For the latest news and information, visit Subscribe to our newsletters or premium content at my I-Connect007.

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