JANUARY 2021 I SMT007 MAGAZINE 77
5
Lean Digital Thread: Micro-Solutions—
Solving One Challenge at a Time
E
Sagi Reuven jumps back to the
manufacturing floor and shares
his thoughts on the role of a
manufacturing execution sys-
tem (MES), reporting, and ana-
lytics. Reuven describes in more
detail the micro-solutions concept and why he
thinks it will make a huge impact on achieving
productivity excellence.
6
Free Download: Leverage Smart
Data Analytics for Industry 4.0
Factories
E
Learn how to leverage your
manufacturing data with The
Printed Circuit Assembler's
Guide to… Smart Data: Using
Data to Improve Manufactur-
ing—the latest title in our I-007e
library.
7
Foundation of the Future:
IPC Students Chapters Gear Up
for Competitions
E
As colleges and universities
continue to adapt to remote
and virtual learning, the IPC
Education Foundation has also
adapted to support its IPC stu-
dent members and 38 IPC stu-
dent chapters across the U.S. With the increase
in distance learning, Aaron Birney describes
how the IPCEF has had to adapt its initiatives
for student chapters.
8
IPC Launches IPC-CFX
Self-Validation and Equipment
Qualification Systems
E
IPC has introduced IPC-CFX Self-Validation and
Equipment Qualification Systems. The IPC-
CFX Self-Validation System is a cloud-based
test bed for equipment vendors and manufac-
turing facilities to self-validate CFX messaging.
9
Training Is Hard,
But It's Also Soft
E
There is a disconnect in many
manufacturing companies. This
article is not about that discon-
nect, but rather a topic that
gets clouded and the objec-
tives made more difficult by
that prevalent disconnect. Business owners,
vice presidents, and operational executives
are expected to have a vision for the company
strategy. But what is not always fully known is
the broad strokes of how to get there.
J
CyberOptics to Present 'Metrology
and Inspection' Paper at Virtual
IEEE PAINE Conference
E
CyberOptics® Corp., a
leading global devel-
oper and manufacturer of
high-precision 3D sensing
technology solutions, was
scheduled, at press time,
to present at the Virtual
IEEE International Con-
ference on Physical Assurance and Inspection
of Electronics (PAINE) in December.
Aaron
Birney
Jahr
Turchan
Sagi
Reuven
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