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Design007-Jan2021

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JANUARY 2021 I DESIGN007 MAGAZINE 73 PCB fabricators. The stackup should be cre- ated at the schematic capture stage and flow through the project to CAM deliverables. This avoids expensive design changes at the end of the project. Stackup planning enables users to quickly explore alternatives in their substrate dimen- sions and material parameters to quickly assess the impact on performance. The right stackup strategy can reduce crosstalk and suppress EMI, ensuring that the signals will remain sta- ble in the intended environment. DESIGN007 References: 1. Beyond Design by Barry Olney as referenced in the text. Barry Olney is managing director of In-Circuit Design Pty Ltd (iCD), Austra- lia. The company developed the iCD Design Integrity software incorporating the iCD Stackup, PDN, and CPW Planner is a PCB Design Service Bureau and specializes in board-level simulation. The software can be downloaded from www.icd.com.au. To read past columns or contact Olney, click here. Figure 5: A fabricator's dielectric materials loss profile (iCD Materials Planner). Figure 6: Multiple technologies on the same layer (iCD Stackup Planner).

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