Design007 Magazine

Design007-Jan2021

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JANUARY 2021 I DESIGN007 MAGAZINE 87 Use of IMS Thermal Materials in Multilayer Stackups for Power Applications E This roundtable discussion brings together the expertise of Ventec International Group's Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design consid- erations, and mechanisms of heat transfer. The Government Circuit: Looking Ahead to 2021 E Before the 116th Congress adjourned for the holidays, IPC expected to secure some policy victories for the electronics manufacturing industry and keep its policy agenda moving forward. Read on—and watch this space—to learn how it all turns out. 2021 Symposium on Counterfeit Parts and Materials: Call for Abstracts E The Surface Mount Technology Association (SMTA) and CALCE University of Maryland are inviting the industry to submit technical papers for presentation at a virtual 2021 Symposium on Counterfeit Parts and Materials. The event is scheduled August 3–5, 2021. Defense Speak Interpreted: What's a VITA? E Ever wonder how military electronics users could swap out circuit cards rapidly and keep their defense systems running? What about a "hot swap" of a circuit card that was ques- tionable. The DoD has helped private industry develop a highly sophisticated set of standards for circuit card input/output (I/O) to make quick change possible. Understanding MIL-PRF-31032, Part 6 E Concluding this six-part discussion on under- standing the military printed circuit board perfor- mance standard MIL-PRF-31032, Anaya Vardya covers the remaining procedure required to address the unique requirements of the military. Stephen Chavez and Happy Holden on Designing Reliable Vias E Andy Shaughnessy and Happy Holden speak with Stephen Chavez, a staff engineer with an aerospace company and chairman of the Printed Circuit Engineering Association (PCEA), about designing vias for greater reli- ability. They also address several areas where they can look to improve reliability, a variety of steps that designers should take to help ensure more robust vias, and some testing and educa- tional resources that PCB designers and design engineers should be aware of. U.S. Congress Approves Funds for R&D on Lead-Free Electronics in Aerospace, Defense and High-Performance Applications E On Monday December 21, 2020 the U.S. Con- gress approved $10 million for research into the issues surrounding lead-free electronics in mission-critical applications. IPC and its allies had called for these funds to be included in the Fiscal 2021 defense appropriations bill. Raytheon and United Technologies Merger: Stronger Together E The 2020 merger of Raytheon Company and the United Technologies Corporation aero- space businesses brought together two com- panies with distinctive legacies of developing and deploying advanced technologies to solve some of the world's most pressing and com- plex challenges.

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