Issue link: https://iconnect007.uberflip.com/i/1335241
FEBRUARY 2021 I SMT007 MAGAZINE 17 understanding the factors that affect tin whis- ker growth and its testing challenges will be outlined. e practical tin whisker criteria for reliability implications in the lead-free envi- ronment and the relative effectiveness of mit- igating measures will be ranked. Second Course: Reliability of Electronics— Role of Intermetallic Compounds As intermetallic compounds (IMCs) play an increasingly critical role in the performance and reliability of solder interconnections in the chip level, package level and board level of lead-free electronics, the second course expands the content coverage on the role of intermetallic compounds in the reliability of electronic products. is course covers the relevant and impor- tant aspects of intermetallic compounds rang- ing from scientific fundamentals to practi- cal application scenarios. I will examine IMCs before solder joint formation, during solder joint formation and aer solder joint formation in storage and during service. Intermetallics at- interface and in-bulk, as well as the role of PCB surface finish/component coating in relation to intermetallics, in turn, to reliability will be discussed. e difference between SnPb and Pb-free solder joints in terms of intermetallic compounds, which affects production-floor phenomena and the actual field failure, will be outlined. e course will also address the rele- vant aspects of newer lead-free alloys that were recently introduced to the market. e virtual setting of the APEX EXPO 2021 will be unique. However, it is the intent to make my courses interactive and lively. More impor- tantly, attendees are encouraged to bring their own issues relevant to the topics for deliber- ation; questions and comments are warmly welcomed. On a lighter note, in this virtual environ- ment, one unintended "fringe benefit" is that the sore feet caused by walking for many hours a day on the expansive and enticing show floor will be spared, while we still can see, learn, observe the exhibits, and interact with the exhibitors on the show floor through the vir- tual platform. As I sied through my previous writings related to IPC APEX EXPO, I want to share what I wrote in March 2001: "Reflections from APEX 2001, "… As I strolled on the exhibit floor, Siemens proudly and confidently demonstrated their newest equipment that offers the capability and precision in handling 0201 components. With the robust market demand in wireless products, this is indeed the year to actually implement the 'tiny' 0201s— be prepared... Another real progress is the keen interest in the alloy selection, technology and applications of lead-free systems as vividly demonstrated across the industry. Actual operation of lead-free assembly production finally extends to the U.S. from the foreign market. A slow yet steady progress in this area is expected… There were many other examples on the show floor that are evidence of the continued technology advancement. At APEX my time ran out unnoticeably and I wish I could have spent more time on the floor…" It's been 20 years since that column, and the "tiny" passive components such as 0201 and 01005 have been implemented success- fully and continue the path on miniaturiza- tion, integration and embedded system. Lead- free alloys, having gone through converging to SAC alloy and then diverging to applica- tion-specific alloys, continue to advance and evolve. is year, without reservation, I expect a variety of new products and frontier technol- ogies to be exhibited; and I look forward to an exuberant, invigorating and enriching expe- rience at IPC APEX EXPO and CES. (Note: is column was written just before CES, scheduled for Jan. 11–14.)