Design007 Magazine

4 DESIGN007 MAGAZINE I FEBRUARY 2021 FEATURES Footprints: A Distributor's Perspective Interview with Geof Lipman FEATURE COLUMNS Circuit Material Library Considerations by John Coonrod The Case for Expansive Parts Libraries by Bob Tise Footprints— Small Steps with a Giant Impact by Kelly Dack FEATURES Best Practices: Footprint Design and CAD Library Management Interview with John Watson Footprint Design Techniques: Don't Trust Datasheets Interview with Tom Hausherr Managing Footprints with Integrated EDA Tools by Matt Walsh A Library Management Cautionary Tale by Stephen V. Chavez FEBRUARY 2021 • FEATURE CONTENTS Many designers count footprints among their most common headaches. This is a critical point in the design process; errors at this stage can wind up having ramifications far downstream. Something as simple as an incorrect pad size can lead to bad solder joints or components floating during reflow. So, this month, we asked our expert contributors to share their thoughts on proper footprint creation and CAD library management. Footprints and Library Management 64 68 72 76 12 28 40 54

• Design007 Magazine — February 2021
• Feature Contents — Footprints and Library Management
• Additional Contents
• FLEX007 Contents
• Column — Footprints and Library Management
• Feature Interview — Best Practices: Footprint Design and CAD Library Management
• Column — Developing Panel Level Semiconductor Packaging
• Feature Interview — Footprint Design Techniques: Don't Trust Datasheets
• Short — Shell, c# AI, Baker Hughes, Microsoft Launch Open AI Energy Initiative
• Column — Avoiding 'Blushing' and 'Bubbling' in Conformal Coatings
• Short — How Unmanned Underwater Vehicles Could Become Easier to Detect
• Feature — Managing Footprints with Integrated EDA Tools
• PCB007 Highlights
• IPC APEX EXPO 2021 — Schedule at a Glance
• IPC APEX EXPO 2021 — Making the Most of a Virtual Event
• Short — Figure It Out: Closing the Gap Between College and Industry with PCEA
• Feature — A Library Management Cautionary Tale
• Column — Stackup Configurations to Mitigate Crosstalk
• Short — Brain-to-Brain Communication Demo Receives DARPA Funding
• Feature Column — Circuit Material Library Considerations
• MilAero007 Highlights
• Feature Column — Footprints—Small Steps with a Giant Impact
• Short — Robot Race: The World's Top 10 Automated Countries
• FLEX007 Feature Column — IC Package Footprints: Why So Many and How Many Is Enough?
• FLEX007 Highlights
• FLEX007 Column — PCB Technologies We Need Now and Later
• FLEX007 Short — Siemens, MaRS to Accelerate Innovation for Startups in Development of Autonomous, Connected Vehicles
• Top 10 Editor Picks from PCBDesign007.com
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