Design007 Magazine

6 DESIGN007 MAGAZINE I FEBRUARY 2021 SHORTS Shell, C3 AI, Baker Hughes, Microsoft Launch Open AI Energy Initiative How Unmanned Underwater Vehicles Could Become Easier to Detect Figure It Out: Closing the Gap Between College and Industry with PCEA Brain-to-Brain Communication Demo Receives DARPA Funding Robot Race: The World's Top 10 Automated Countries DEPARTMENTS Career Opportunities Educational Resource Center Advertiser Index & Masthead IPC APEX EXPO 2021 PREVIEW Schedule at a Glance Full schedule of events at the show Making the Most of a Virtual Event Interview with Alicia Balonek COLUMNS Footprints and Library Management by Andy Shaughnessy Developing Panel Level Semiconductor Packaging by Vern Solberg Avoiding 'Blushing' and 'Bubbling' in Conformal Coatings by Phil Kinner Stackup Configurations to Mitigate Crosstalk by Barry Olney HIGHLIGHTS PCB007 MilAero007 Top 10 PCBDesign007 35 39 53 63 80 99 108 109 44 46 10 22 36 58 43 71 96 FEBRUARY 2021 • ADDITIONAL CONTENTS 46

• Design007 Magazine — February 2021
• Feature Contents — Footprints and Library Management
• Additional Contents
• FLEX007 Contents
• Column — Footprints and Library Management
• Feature Interview — Best Practices: Footprint Design and CAD Library Management
• Column — Developing Panel Level Semiconductor Packaging
• Feature Interview — Footprint Design Techniques: Don't Trust Datasheets
• Short — Shell, c# AI, Baker Hughes, Microsoft Launch Open AI Energy Initiative
• Column — Avoiding 'Blushing' and 'Bubbling' in Conformal Coatings
• Short — How Unmanned Underwater Vehicles Could Become Easier to Detect
• Feature — Managing Footprints with Integrated EDA Tools
• PCB007 Highlights
• IPC APEX EXPO 2021 — Schedule at a Glance
• IPC APEX EXPO 2021 — Making the Most of a Virtual Event
• Short — Figure It Out: Closing the Gap Between College and Industry with PCEA
• Feature — A Library Management Cautionary Tale
• Column — Stackup Configurations to Mitigate Crosstalk
• Short — Brain-to-Brain Communication Demo Receives DARPA Funding
• Feature Column — Circuit Material Library Considerations
• MilAero007 Highlights
• Feature Column — Footprints—Small Steps with a Giant Impact
• Short — Robot Race: The World's Top 10 Automated Countries
• FLEX007 Feature Column — IC Package Footprints: Why So Many and How Many Is Enough?
• FLEX007 Highlights
• FLEX007 Column — PCB Technologies We Need Now and Later
• FLEX007 Short — Siemens, MaRS to Accelerate Innovation for Startups in Development of Autonomous, Connected Vehicles
• Top 10 Editor Picks from PCBDesign007.com
• Career Opportunities Section
• I-007e Educational Resource Center
• Advertiser Index and Masthead
• I-Connect007 Subscription and Contact Information