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8 6 4 2 0 Peel strength [N/cm] Etch depth [µm] ShengYi S1000-2 ShengYi S1000-2 (12 x reflow) ShengYi S1155 ShengYi S1155 (12 x reflow) 0.8 1 1.2 A key benefit of the new BondFilm ® HP is a high copper capacity and low sludge over the market-standard oxide replacement processes. It is higher than a 40% increase in copper content compared to conventional oxide replacement systems. Sufficient adhesion for I/L bonding on different Tg materials can already be obtained with an etch depth of only 0.8 μm, while still assuring excellent thermal reliability. The low sludge character- istic of the BondFilm ® HP process shows great operational benefits, and significantly reduces equipment maintenance and downtime frequency. atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com BondFilm ® HP Pic. 1: BondFilm ® HP Pic. 2: Peel strength results with BondFilm ® HP Next genera on of bonding enhancement with op mum process cleanliness for I/L bonding Low sludge requirement g/L high copper loading > 35