PCB007 Magazine

PCB007-Mar2021

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REVOLUTIONARY DIE BONDING SOLUTIONS Sintering Technologies for High Performance & High Reliability Fully Sintered Nano-Silver with Unmatched Power Cycling for EV Power Electronics • High performance paste, film and preform • Inverters, converters, chargers • Highest junction temperature stability / 250°C • Grade-zero automotive reliability proven • 2,000,000 power cycles @ delta 80°C Hybrid Silver Sintering Pressure-Less Die Attach for In-Cabin & Autonomous Functions • High performance paste and film • 5G / LiDaR / ADAS / sensors and processors • Exceptional thermal and MSL1 performance • Flexible material properties for different packages • Backwards compatible with epoxy die bonding process macdermidalpha.com © 2021 MacDermid, Inc. and its group of companies. All rights reserved. "(R)" and "TM" are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries. Powertrain HEV motor control - IGBT module, IPM, drive IC Transmission control - pQFN Steering control - pQFN Engine Engine control - pQFN Body Headlamp/Interior lamp control - pQFN AV and accessory control - pQFN

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