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Design007-May2021

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86 DESIGN007 MAGAZINE I MAY 2021 with existing PCB fabrication equipment, so it does not require the costly capital investment usually associated with new technologies, allowing even the smaller and mid-size shops to offer this advanced technology to their customers. While this process certainly gives us the ben- efit of 25 µm line/space and below, the additive process also has RF benefits at larger feature sizes, such as improving impedance control. I think we are just scratching the surface of how to get the most benefit from this capability. I am already seeing the simplification of com- plex designs, improving yields, and reducing costs. I am excited to see where this technol- ogy takes us. Dunn: Cherie, as we wrap up, what advice would you give to PCB designers who are just hearing about the opportunity to work with fabricators that can now offer these fine feature sizes? Litson: Start today! Do some research, share your concerns, share your experiences, try it out. I can see many benefits to utilizing this process at the 75 µm, 50 µm, and 25 µm trace sizes and smaller. Dunn: ank you so much for talking with me today. To learn more, what is the best way to reach you? Litson: e best way to reach me is at Litson1@ aol.com. ank you. DESIGN007 Tara Dunn is the vice president of marketing and business development for Averatek. To read past columns or contact Dunn, click here. Cherie teaching a class during the pandemic.

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