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• Design007 Magazine — May 2021
• Feature Contents — Top Design Challenges
• Additional Contents
• Flex007 Contents
• Column — What Are Your Top Design Challenges?
• Feature Interview — PCB Design Challenges: Designing With DDR
• Feature Article — The Top Five Reasons Products Fail EMI Testing
• Column — A Closer Look at Surface Finish
• Short — Machine Learning Algorithm Helps Unravel the Physics Underlying Quantum Systems
• Feature Column — My Top Six Design Challenges
• Feature Article — Planning and Communication: Key to Optimizing Your Design Time
• Short — Canon Medical Expands AI-Based Image Reconstruction Technology
• Column — DDR Routing—and Other Big Fish in the Lake of Technology
• Feature Article — My Ongoing Journey Toward DFM
• PCB007 Highlights
• Article — Analyzing Complex High-Density PCBs With Online DFM
• Short — Scientists Glimpse Signs of a Puzzling State of Matter in a Superconductor
• Column — Test for Design—How Do You Measure Up?
• Short — Book Excerpt 'The Printed Circuit Designer's Guide to… Thermal Management: A Fabricator's Perspective,' Chapter 2: IMPCBs or MCPCBs
• Feature Article — Meeting the Challenge With Design Reuse
• MilAero007 Highlights
• Column — Pin-Out Challenge: Rethink the Solution
• Short — A Roundup of Stackup Coverage
• Column — Conformal Coating vs. Encapsulation Resin
• Short — New Method Measures Super-Fast, Free Electron Laser Pulses
• Flex007 Column — Designing Via-in-pad for Higher-Density Flexible Circuits
• Short — Plastic Logic's Colour Display Revolutionizes Smart Wearables
• Flex007 Highlights
• Flex007 Column — Process Flow for Occam QFN Test Vehicle
• Top 10 Editor Picks from PCB Design007.com
• Career Opportunities Section
• I-007e Educational Resource Center
• Advertiser Index and Masthead
• Subscribe to Our Monthly Magazines