PCB007 Magazine

PCB007-May2021

Issue link: http://iconnect007.uberflip.com/i/1372612

Contents of this Issue

Navigation

Page 105 of 125

106 PCB007 MAGAZINE I MAY 2021 1 Technical Conference—Balancing Conventional and Disruptive Technologies E I thought the three keynotes given by IPC President and CEO John Mitchell, Industry Week Editor-in-Chief Travis Hessman, and IPC Chief Economist Shawn DuBravac, were spot on. ey all spoke to the fact that the way products are conceived, designed, man- ufactured, and used is changing rapidly. ey all underscored the need for increased indus- try collaboration to help bring the factory and supply chain of the future to life. 2 Amphenol Completes Acquisition of MTS Systems E Amphenol Corporation, a leading global provid- er of high-technolog y interconnect, antenna and sensor solutions, an- nounced that it has completed its acquisition of MTS Systems Corporation (MTS). 3 The Plating Forum: RAIG (Reduction Assisted Immersion Gold) for Gold Surface Finishes E Since its inception, more gold finishes are finding RAIG gold to be a viable al- ternative to standard im- mersion gold. RAIG gold is a mixed reaction bath that functions as an immersion gold and with the added re- ducing agent it also functions as an electroless (autocatalytic) bath. 4 Averatek Announces A-SAP License Agreement with FTG E Averatek Corporation has announced FTG as an A-SAP licensee. A-SAP is an advanced PCB manufacturing technology that enables feature sizes of 25 microns and below, effectively pro- viding PCB designers with new opportunities to address the challenges of next-generation electronics. Editor Picks from PCB007 George Milad

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-May2021