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Page 26 of 125

www.atotech.com info @ atotech.com If you would like to know more, visit our webinar on BondFilm® HP. Just scan the QR-code to the right. The printed circuit board industry is one of the most competitive markets in the world. Many participate, but only a few stand out and lead the way. With our new future proof oxide replacement process for innerlayer bonding of PCBs, BondFilm ® HP, we have succeeded in developing a high-tech drop-in solution that is both better for our precious environment and keeps maintenance to an absolute minimum. All this has been achieved while being super- efficient in terms of productivity, yield and a reduction of sludge by 95%. BondFilm ® HP offers excellent adhesion and thermal reliability with an etch depth as low as 0.8µm. Something to be proud of: Unmatched performance for the most demanding bonding applications.

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