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If you would like to know more, visit our webinar on BondFilm® HP.
Just scan the QR-code to the right.
The printed circuit board industry is one of the most competitive markets in the world.
Many participate, but only a few stand out and lead the way. With our new future proof oxide
replacement process for innerlayer bonding of PCBs, BondFilm
®
HP, we have succeeded
in developing a high-tech drop-in solution that is both better for our precious environment
and keeps maintenance to an absolute minimum. All this has been achieved while being super-
efficient in terms of productivity, yield and a reduction of sludge by 95%. BondFilm
®
HP
offers excellent adhesion and thermal reliability with an etch depth as low as 0.8µm.
Something to be proud of:
Unmatched performance for the most
demanding bonding applications.
