Issue link: https://iconnect007.uberflip.com/i/1372612
MAY 2021 I PCB007 MAGAZINE 61 from NIST [3] . A fundamental place to start is with "Select the Right Statistical Tools" (Mea- surement System Analysis, SPC, Comparative Methods or DOE). FMEA FMEA is the failure mode effect analysis [4] and is critical for problem solving. e link in the reference provides an in-depth overview of FMEA. An example of just one failure mode relat- ed to use of an inner layer bonding process is shown in Table 2. Of course, there are multiple process steps to consider. Here for purposes of illustration, we only show issues related to lack of uniformity of the coating appearance. Note that the higher the value in the severity col- umn, the greater the effect on the defect. Certainly, there are additional skills I would recommend, including improving one's tech- nical writing skills. However, what about acquiring additional skills related to PCB fabrication and assembly? is is where IPC comes in. IPC Standards and Certification Preparing your workforce to successful- ly face challenges inherent in today's complex manufacturing environment may be the most important investment management makes. Certainly, equipment and automation are sig- nificant investments. However, without a well- trained workforce, these investments will be very slow to pay off. is all starts with the standards. Why use IPC standards? First, adoption of IPC stan- dards across the electronics industry supply chain enhances the quality and the reliabili- ty of electronics products. Adoption and use of IPC standards drive quality of the finished product as well as the consistency of the pro- cesses used in the fabrication of the device in- cluding printed circuit board and printed cir- cuit assemblies. Train your employees in the understanding and use of these workmanship standards. When you build product to IPC standards, there are several other quantifiable benefits to your business. ese include: • Increased customer satisfaction • Improved production efficiencies • Improved final yields • Improved workforce performance A hidden benefit of improved workforce per- formance is that the employees associated with the process gain a deeper connection to their job and gain additional pride in what they are doing. When you have a high-quality and con- sistent manufacturing process, yields go up, product is delivered to the customer on time and in full, and rework is minimized. IPC has multiple workforce training pro- grams available in various formats including in-person training and through IPC Edge [5] (the online educational and training portal of IPC). While this article only brings to light several of the critical skills and tools required for opti- mizing performance, there are other skills and tools that at some point should be considered. However, if one can acquire or improve on the skills we outlined here, one will achieve a much deeper understanding of critical aspects of the printed circuit board fabrication process and in turn ensuring the product is of the high- est reliability. As always, understanding linkag- es between processes, materials, and manufac- turing operations will provide the team with more effective and efficient problem-solving resolution. PCB007 References 1. www.leanscape.io/dmaic-model/ 2. The Fishbone Diagram (Ishikawa Diagram) 3. Statistical Engineering Handbook 4. Failure Mode Effect Analysis 5. Homepage | IPC Edge Training Michael Carano is VP of technol- ogy and business development for RBP Chemical Technology. To read past columns or contact Carano, click here.