SMT007 Magazine

SMT007-July2021

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JULY 2021 I SMT007 MAGAZINE 59 Siemens Acquires proFPGA Product Family from PRO DESIGN E Building on the recent announcement of its next-generation Veloce hardware-assisted verification system for integrated circuits (ICs), Siemens Digital Industries Soware has signed an agreement with Germany-based PRO DESIGN Electronic GmbH to acquire its proFPGA product family of Field Programma- ble Gate Array (FPGA) desktop prototyping technologies. Hitachi Establishes New Semiconductor Engineering Facility in Portland, U.S. E Hitachi High-Tech Corporation and Hitachi High-Tech Group company, Hitachi High-Tech America, Inc., announce the establishment of Hitachi's Center of Excellence in Portland, a new centralized facility for semiconductor engineering in Hillsboro, Oregon. Henkel Invests in Innovation Center in Shanghai E Henkel announced the construction of a new Adhesive Technologies Innovation Center in Shanghai. With an investment of more than 60 million Euro (RMB 500 million), the state-of- the-art facility will transform Henkel's current Zhangjiang site into an Innovation Center for China and Asia-Pacific. Driving in the Snow is a Team Effort for AI Sensors E Nobody likes driving in a blizzard, including autonomous vehicles. To make self-driving cars safer on snowy roads, engineers look at the problem from the car's point of view. North American Semiconductor Equip- ment Industry Posts April 2021 Billings E North America-based semiconductor equip- ment manufacturers posted $3.41 billion in billings worldwide in April 2021 (three-month average basis), according to the April Equip- ment Market Data Subscription (EMDS) Bill- ings Report published by SEMI. Cutting the 'Key' to an Unhackable 5G Network E Scientists from Heriot-Watt University have secured six-figure funding from Innovate-UK on a project led by BT to develop a practical quantum key distribution (QKD) transmitter and receiver modules for short range terres- trial applications. PTT, Foxconn Announce Venture on Electric Vehicle Production Platform E H.E. General Prayut Chan-o-cha, Prime Minister of ailand, presided over the Vir- tual Signing Ceremony of a Memorandum of Understanding (MoU) for a Development and Manufacturing EV project in ailand between PTT Public Company Limited, the largest publicly listed conglomerate in ai- land and Hon Hai Technology Group (Fox- conn), the leading global technological solu- tion provider. Cadence Accelerates Cloud Hyperscale Infrastructure E Cadence Design Systems, Inc. announced immediate availability of Cadence® IP support- ing the PCI Express® (PCIe®) 5.0 specification on TSMC N5 process technology.

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