JULY 2021 I SMT007 MAGAZINE 59
Siemens Acquires proFPGA Product
Family from PRO DESIGN
E
Building on the recent announcement of its
next-generation Veloce hardware-assisted
verification system for integrated circuits
(ICs), Siemens Digital Industries Soware
has signed an agreement with Germany-based
PRO DESIGN Electronic GmbH to acquire its
proFPGA product family of Field Programma-
ble Gate Array (FPGA) desktop prototyping
technologies.
Hitachi Establishes New Semiconductor
Engineering Facility in Portland, U.S.
E
Hitachi High-Tech Corporation and Hitachi
High-Tech Group company, Hitachi High-Tech
America, Inc., announce the establishment
of Hitachi's Center of Excellence in Portland,
a new centralized facility for semiconductor
engineering in Hillsboro, Oregon.
Henkel Invests in Innovation Center
in Shanghai
E
Henkel announced the construction of a new
Adhesive Technologies Innovation Center in
Shanghai. With an investment of more than 60
million Euro (RMB 500 million), the state-of-
the-art facility will transform Henkel's current
Zhangjiang site into an Innovation Center for
China and Asia-Pacific.
Driving in the Snow is a Team Effort
for AI Sensors
E
Nobody likes driving in a blizzard, including
autonomous vehicles. To make self-driving
cars safer on snowy roads, engineers look at the
problem from the car's point of view.
North American Semiconductor Equip-
ment Industry Posts April 2021 Billings
E
North America-based semiconductor equip-
ment manufacturers posted $3.41 billion in
billings worldwide in April 2021 (three-month
average basis), according to the April Equip-
ment Market Data Subscription (EMDS) Bill-
ings Report published by SEMI.
Cutting the 'Key' to an Unhackable
5G Network
E
Scientists from Heriot-Watt University have
secured six-figure funding from Innovate-UK
on a project led by BT to develop a practical
quantum key distribution (QKD) transmitter
and receiver modules for short range terres-
trial applications.
PTT, Foxconn Announce Venture on
Electric Vehicle Production Platform
E
H.E. General Prayut Chan-o-cha, Prime
Minister of ailand, presided over the Vir-
tual Signing Ceremony of a Memorandum
of Understanding (MoU) for a Development
and Manufacturing EV project in ailand
between PTT Public Company Limited, the
largest publicly listed conglomerate in ai-
land and Hon Hai Technology Group (Fox-
conn), the leading global technological solu-
tion provider.
Cadence Accelerates Cloud Hyperscale
Infrastructure
E
Cadence Design Systems, Inc. announced
immediate availability of Cadence® IP support-
ing the PCI Express® (PCIe®) 5.0 specification
on TSMC N5 process technology.
