Issue link: https://iconnect007.uberflip.com/i/1401769
© 2021 MacDermid, Inc. and its group of companies. All rights reserved. "(R)" and "TM" are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries. Single-Step Copper Through Hole Filling MacuSpec THF 100 is your solution for enhanced structural reliability in advanced electronic designs. Complete void-free copper filling of PCB through holes in a single plating step Can replace conductive paste plugging and planarization processes Improves structural integrity of advanced designs Efficient thermal management for improved device life Laser Drilled X-Via Through Holes Mechanically drilled Through Holes Void-Free Copper by X-Ray UPGRADE YOUR DESIGN CAPABILITY WITH MacuSpec ™ THF 100