Design007 Magazine

8 DESIGN007 MAGAZINE I SEPTEMBER 2021 SEPTEMBER 2021 • CONTENTS FLEX007 FEATURE Applying DFM Analysis to Flexible PCBs by Patrick McGoff HIGHLIGHTS Flex007 FLEX007 FEATURE COLUMN Intellectual Property— How It Works for the Benefit of All by Joe Fjelstad FLEX007 SHORT Argonne National Lab and Hewlett Packard Enterprise Prepare for Exascale Era By their very nature, flexible and rigid-flex circuits can benefit greatly from the "left-shift" of manufacturing-aware capabilities earlier in the design process. This month, Patrick McGoff of Siemens EDA outlines how DFM analysis tools can shrink the distance between flex designers and manufacturers—and the design cycle. This Month in Flex 72 80 82 86 FLEX 72 86 82

• Design007 Magazine — September 2021
• Feature Contents — Collaboration by Design
• Additional Contents
• Flex007 Contents
• Column — Collaboration by Design
• Feature Interview — Collaboration: The Key to Streamlining Your Design Process
• Column — How to Increase the Reliability of Conformal Coatings
• Feature Column — PCB Design—It's a Team Sport
• Feature Article — The Power of Designer and Manufacturer Collaboration
• Column — PDN Trends and Challenges
• Article — DFM 101: Layer Stackup
• PCB007 Highlights
• Feature Article — Collaboration by Design: The Role of EDA Tools
• Short — Review: Siemens PCB Stackup Planning Webinar
• Feature Column — The Collaborative PCB Design Process—a Necessity for Efficient Manufacturing
• Column — Interaction—The Cure for Industry Contraction
• Short — Robots Who Goof: Can We Trust Them Again?
• MilAero007 Highlights
• Feature Column — Collaboration to Shorten the Learning Curve
• Short — Excerpt: The System Designer's Guide to… System Analysis, Chapter 2
• Column — Designing PCBs for Electronic Hardware Products
• Short — Hire or Be Hired at jobConnect007
• Flex007 Article — Applying DFM Analysis to Flexible PCBs
• Flex007 Highlights
• Flex007 Column — Intellectual Property—How It Works for the Benefit of All
• Flex007 Short — Argonne National Lab and Hewlett Packard Enterprise Prepare for Exascale Era
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