Design007 Magazine

Design007-Oct2021

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© 2021 MacDermid, Inc. and its group of companies. All rights reserved. "(R)" and "TM" are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries. NEXT GENERATION METALLIZATION TECHNOLOGIES specifically designed to SOLVE FLEXIBLE CIRCUITRY CHALLENGES FIB Cut Blackhole LE / Eclipse LE Low etch direct metallization processes with minimal etching that enable subtractive HDI and mSAP on a wide range of materials. ViaDep 4550 Versatile electroless copper process that deposits copper with zero internal stress, enabling excellent adhesion on flex and rigid-flex designs. Systek SAP & SAP Flex Semi-additive processes for creation of initiation layers in package substrates and with excellent adhesion to flexible materials for ultra fine lines and spaces.

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