Design007 Magazine

Design007-Nov2021

Issue link: http://iconnect007.uberflip.com/i/1426508

Contents of this Issue

Navigation

Page 5 of 117

6 DESIGN007 MAGAZINE I NOVEMBER 2021 SHORTS All Systems Go! Signal Integrity Signoff of 3D-IC Systems Elementary, Mr. Watson: First, Component Shortages, and Now Hot Dogs? Nanoscale Lattices Flow From 3D Printer Book Excerpt: The System Designer's Guide to... System Analysis A New 3D Printing Frontier: Self-Powered Wearable Devices DEPARTMENTS Career Opportunities Educational Resource Center Advertiser Index & Masthead ARTICLES DFT and Test Strategies Shouldn't Be an Afterthought Interview with William Webb 45+ Years of PCB Manufacturing Experience Interview with Kim O'Neil American Standard Circuits on the Fundamentals of RF and Microwave PCBs by Pete Starkey COLUMNS Data Management: It's a Lot Like Herding Cats by Andy Shaughnessy Impact of Filled Vias on Thermal and Signal Integrity by Barry Olney A Grand Announcement by Kelly Dack Diving Into the Chemical Processes of PCB Manufacturing by Matt Stevenson HIGHLIGHTS PCB007 MilAero007 Top Ten Editor's Picks 24 29 42 60 70 101 116 117 38 48 76 10 30 66 82 36 80 98 NOVEMBER 2021 • ADDITIONAL CONTENTS 66 82

Articles in this issue

Archives of this issue

view archives of Design007 Magazine - Design007-Nov2021