Design007 Magazine

Design007-Nov2021

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A-SAP ™ Averatek semi-additive process offers a 90% reduction in size and weight over current state-of-the-art with 15 micron (.6 mm) trace and space Smaller is better. More info on A-SAP™ www.averatek.com 19mm 6mm Typical capability in the USA today: 75 microns A-SAP™: 25 microns and below A-SAP ™ allows use of much smaller packages A-SAP ™ enables ultra-high electronics density

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