PCB007 Magazine

PCB007-Nov2021

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28 PCB007 MAGAZINE I NOVEMBER 2021 Feature Interview by Nolan Johnson I-CONNECT007 Nolan Johnson recently spoke with Summit Interconnect's Gerry Partida about disruptive new methods for analyzing and quantifying potential manufacturing challenges in designs while still in the design phase. Nolan Johnson: Gerry, what's the background for the new methods we're about to discuss? Gerry Partida: e industry is at a new point in evolving how we look at building boards. Our industry has historically built boards and then tried to find a test for them. en, when they found a test for it, they figured out that it needed to be analyzed before they built the board. We did this with electrical test. We built boards and down the road, as people started asking, "Why am I buying bad boards? We should electrically test them," electrical test was introduced, reluctantly, into the test part of manufacturing printed circuit boards by suppliers or fabricators. en they embraced it. But when we started testing boards, we did comparison tests. We would build a bunch of boards, put the first one on a tester, tell it to self-learn, and compare all the boards to the first board. If they all matched, they all shipped as matched boards, but if they had the same defect, they all shipped with the same defect. is did happen. It wasn't for another 10 or 15 years that we took extracted netlist from the CAD so- ware and compared it to the Gerber data that would be used to fabricate the board, to find out whether everything was corrected before we started manufacturing. We would find that there was a problem, and we would fix it or get new data. en when we knew we had a match, we started to manufacture the boards and downloaded the program to the tester. But this was an evolution of about 15 to 25 years. It depends on what point of view you take from it. We've done the same thing with microvias. We've been building microvias. ere are data- sheets that talk about the modulus and the CTE expansion aer reflow, before Tg, and aer Tg, New Methods for Quantifying PCB Design Weaknesses and Manufacturing Challenges

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