PCB007 Magazine

4 PCB007 MAGAZINE I NOVEMBER 2021 FEATURE ARTICLES Test and Inspection: Competitive Advantages and Cost of Doing Business Interview with Charlie Capers Design to Production Flow: DFT and Test Coverage Using Industry 4.0 Principles to Produce Good Products by William Webb Alex Stepinski: A Philosophical View Interview with Alex Stepinski FEATURE ARTICLES Test and Inspection: Far Beyond Opens and Shorts Interview with Todd Kolmodin Fascinating Opportunities in Flying Probe Testing Interview with Peter Brandt New Methods for Quantifying PCB Design Weaknesses and Manufacturing Challenges Interview with Gerry Partida 42 52 62 10 20 28 NOVEMBER 2021 • FEATURED CONTENT With new inspection technologies and methods, along with AI and advancing data col- lection, fabricators have new options to consider in their inspection practices. In this issue we look at how new capabilities drive on-floor best practices, and how new best practices are influencing equipment design. Test and Inspection 10 28 42 62

• PCB007 Magazine — November 2021
• Featured Content — Test and Inspection
• Additional Content
• Column — Test and Measurement: Drawing Inspiration from IC Design
• Feature Interview — Test and Inspection: Far Beyond Opens and Shorts
• Feature Interview — Fascinating Opportunities in Flying Probe Testing
• Short — I-Connect007 Launches Real Time with…American Standard Circuits Event
• Feature Interview — New Methods for Quantifying PCB Design Weaknesses and Manufacturing Challenges
• Column — Better Electronics Start with Better Training
• Short — Additive Reality: Drop Your (Solder) Mask, it's Sampling Time
• Feature Interview — Test and Inspection: Competitive Advantage and Cost of Doing Business
• Supplier Highlights
• Feature Article — Design to Production Flow: DFT and Test Coverage Using Industry 4.0 Principles to Produce Good Products
• Short — Keysight's Massively Parallel Board Test
• Electronics Industry News and Market Highlights
• Feature Interview — Alex Stepinski: A Philosophical View
• Column — Induction Lamination
• Column — The Significance of IPC ENIG Specification 4552 Revision B
• MilAero007 Highlights
• Column — The New Electrical Test: Riding the Wave
• Short — 'Thermal Switches' Dynamically Moderate Heat of Electronic Devices
• Article — 2021 International Electronics Circuit Exhibition (Shenzhen) Coming December 8-10
• Short — BYU Researchers Create World's Most Power-Efficient High-Speed ADC Microchip
• Top Ten Editor's Picks
• Career Opportunities Section
• I-007e Educational Resource Center
• Advertiser Index and Masthead
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