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© 2021 MacDermid, Inc. and its group of companies. All rights reserved. "(R)" and "TM" are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries. Simultaneous Via Filling / Through Hole Plating The single solution for electroplating for high density interconnects in mSAP and more. Single step filling of micro vias, laser drilled X-vias, and conformal plating of through holes V-pit resistant deposit improves quality and eliminates reliability concerns Excellent pattern plating process for substrate-like HDI designs Fully analyzable by CVS and common analytical tools Versatile Copper Plating, Minimal Surface Build-Up IMPROVE YOUR ELECTROPLATING LINE WITH MacuSpec ™ VF-TH 300 V-pit Resistant As Plated Etching 3 µm Etching 6 µm VF-TH 300 Other