102 DESIGN007 MAGAZINE I DECEMBER 2021
Columnist Ruben
Contreras talks
about producing
high-tech PCBs from
design to volume
production, since it
is within this area
that customers often
do not reach their
initial targets regarding time, cost, and
performance.
During DesignCon, the I-Con-
nect007 Editorial Team spoke
with Mike Vinson and Paul
Dennig of Averatek. They dis-
cussed the company's latest
advances in air cavities and
semi-additive processes, and
what this new technology will
mean to the industry, especially PCB designers.
Vinson said, "Over the next 12 months, I think you'll
see more involvement from a number of areas—
everything from sensors to the actual printed
circuit boards themselves and miniaturization."
Most electronic products today are assembled
using the no-clean soldering process. The need
for no-clean solder pastes emerged in response
to legislation against the use of ozone-depleting
chemicals, and the appeal of removing the costly
flux cleaning operations in the assembly of PCBs.
TOP TEN
Fresh PCB Concepts:
High-tech PCBs from
Design to Volume Production
Averatek Moves Ahead With
A-SAP™, ASAP
DownStream Adding More Flex,
Rigid-Flex Functionality
Nolan Johnson recently spoke with Joe Clark, one of the co-founders of
DownStream Technologies. We discussed the company's latest software
release, which adds more flex and rigid-flex capabilities, as well as updates
to the scripting in DownStream's tools. As Joe explained, "With our current
release of software, we focused on rigid-flex designs, which is becoming a
common design challenge for our customers."
Vinton & Denning
Ruben Contreras
Joe Clark
EDITOR'S
PICKS
Beyond Design: The Impact of No-Clean Flux Residue on Signal Integrity
