PCB007 Magazine

PCB007-Dec2021

Issue link: http://iconnect007.uberflip.com/i/1437606

Contents of this Issue

Navigation

Page 79 of 147

80 PCB007 MAGAZINE I DECEMBER 2021 Siemens Reconfirms Commitment to Shipbuilding 4.0 with CESENA Opening E Siemens has inaugurated the Center of Excel- lence of the Naval Sector (CESENA) in Fer- rol, Spain, where state-of-the-art facilities are equipped with the latest technologies to improve all phases of the ship design and construction process with the aim of trans- forming the entire value chain of the ship- building industry and boosting its competi- tiveness. Empower Semiconductor Signs Global Distribution Agreement with Mouser Electronics E Empower Semiconductor, Inc. announces a new global distribution agreement with Mouser Electronics Inc., the authorized global distrib- utor with the newest semiconductors and elec- tronic components. IDC FutureScape: Top 10 Predictions for the Future of Digital Infrastructure E International Data Corporation's (IDC) top 10 predictions for the Future of Digital Infrastruc- ture point to a digital infrastructure strategy that addresses resiliency and trust; data-driven operational complexity; and business out- comes-driven sourcing and autonomous oper- ations. Study: Semiconductor Supply Chain Remains Vulnerable Without Federal Investment E A new study about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen domestic packaging ecosystem to meet increased production of semiconduc- tor chips, without which the semiconductor supply chain is likely to remain weak and vul- nerable. JMA Wireless, Kyocera to Accelerate 5G Deployment Across Japan E JMA Wireless ( JMA) and Kyocera Corpora- tion (Kyocera) announced an agreement to jointly develop a 5G millimeter-wave back- haul system. Leveraging Kyocera's wireless base station technology and JMA's XRAN— the only 100% soware-based open-RAN (O-RAN) solution on the market—this first- of-its-kind system will accelerate 5G network deployment across Japan. Qualcomm Collaborates with NEC to Develop 5G Open and Virtualized Solutions E Qualcomm Technologies, Inc., and NEC Cor- poration announced a strategic collaboration in which they are partnering on the develop- ment of a 5G open and virtualized distributed unit (DU) powered by the Qualcomm® X100 5G RAN Accelerator Card, to drive the transi- tion towards modern networks. Keysight Enables NEC Europe to Verify Performance of Open RAN Equipment E Keysight Technologies, Inc. announced that NEC Europe Ltd. has selected Keysight to cre- ate an advanced radio frequency (RF) propa- gation environment for verifying the perfor- mance of open radio access network (RAN) base stations equipped with massive multiple input multiple output (MIMO) technology.

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-Dec2021